doc. no : qw0905-LVA3331-PF rev. : a date : 27 - mar. - 2006 data sheet super bright round type led lamps LVA3331-PF pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
-60 100% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 50% 75%0 25% 50% 25%75%100% 30 -30 60 0 package dimensions part no. LVA3331-PF page 1/5 ligitek electronics co.,ltd. property of ligitek only 25.0min 2.54typ 1.0min 0.5 typ 8.6 7.6 1.5max 5.0 5.9 + -
ligitek electronics co.,ltd. property of ligitek only unit vy ratings mw ma a v 60 75 10 2000 30 ma page 2/5 -40 ~ +100 20 min. min. max. 900 1.72.6 20 590 2200 typ. dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) forward voltage @20ma(v) spectral halfwidth nm -40 ~ +85 parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) forward current storage temperature emitted yellow LVA3331-PF algainp part no material operating temperature absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. tstg orange transparent lens color i f t opr ir pd i fp symbol esd static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LVA3331-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy - va chip page 3/5 part no. LVA3331-PF
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 60 seconds max preheat 0 0 25 2 /sec max 50 100 time(sec) 150 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LVA3331-PF
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.t.sol=230 5 2.dwell time=5 1sec solderability test thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test high temperature high humidity test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description ligitek electronics co.,ltd. property of ligitek only operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test reliability test: test condition test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard 5/5 page part no. LVA3331-PF
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